[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Reliability of column/board/CCGA attachment
- 作者Ghaffarian, Reza
- 文件大小1320.98KB
- 发表时间2012
- DOI10.1109/itherm.2012.6231486
- 页码619-627
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Table of contents2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - [Cover]2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - [Front cover]2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITherm commitees - 2012 [read: committees]2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - This page intentionally left blank2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - New thermoelectric materials and applicationsJovanovic, Velimir; Ghamaty, Saeid; Bass, John C. · 2012
[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Proceedings of the Thirteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITherm 2012 [Copyright notice]2012
CCGA packages for space applicationsReza Ghaffarian · 2006
Chip scale package issuesReza Ghaffarian · 2000
Update on CGA packages for space applicationsGhaffarian, Reza · Microelectronics Reliability · 2016
Size effect and strength variability of unidirectional compositesS. B. Batdorf; Reza Ghaffarian · 1984
Carbon nanotubes in microwave foaming of thermoplasticsRezvanpanah, Elham; Ghaffarian Anbaran, S. Reza; Maio, Ernesto Di · Carbon · 2017
Statistical treatment of stress concentration factors in damaged compositesS. B. Batdorf; Reza Ghaffarian · 1982
Dyslipidemia and cardiovascular disease risk among the MASHAD study populationHedayatnia, Mahshad; Asadi, Zahra; Zare-Feyzabadi, Reza; Yaghooti-Khorasani, Mahdiyeh; Ghazizadeh, Hamideh; Ghaffarian-Zirak, Roshanak; Nosrati-Tirkani, Abolfazl; Mohammadi-Bajgiran, Maryam; Rohban, Mohadese; Sadabadi, Fatemeh; Rahimi, Hamid-Reza; Ghalandari, Marzieh; Ghaffari, Mohammad-Seddigh; Yousefi, Asa; Pouresmaeili, Elnaz; Besharatlou, Mohammad-Reza; Moohebati, Mohsen; Ferns, Gordon A.; Esmaily, Habibollah; Ghayour-Mobarhan, Majid · Lipids in Health and Disease · 2020
Reliability of PWB microvias for high density package assemblyGhaffarian, Reza · International Journal of Materials and Structural Integrity · 2008