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[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Solid-state bonding using metallic cone layer for interconnection

[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Solid-state bonding using metallic cone layer for interconnection

Ming Li, ; Anmin Hu, ; Chen, Zhuo; Qin Lu, ; Zhang, Wenjing; Suga, Tadatomo; Yinghui Wang, ; Higurashi, Eiji; Fujino, Masahisa
  • 作者Ming Li, ; Anmin Hu, ; Chen, Zhuo; Qin Lu, ; Zhang, Wenjing; Suga, Tadatomo; Yinghui Wang, ; Higurashi, Eiji; Fujino, Masahisa
  • 文件大小1603.65KB
  • 发表时间2012
  • DOI10.1109/icsj.2012.6523396
  • 页码1-5
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