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[IEEE 2012 25th International Conference on VLSI Design. VLSI Design 2012. Held jointly with 11th International Conference on Embedded Systems - Hyderabad (2012.01.7-2012.01.11)] 2012 25th International Conference on VLSI Design - Embedded Tutorial ET3: Packaging Trends, Die Package Co-Design Flow and Challenges

[IEEE 2012 25th International Conference on VLSI Design. VLSI Design 2012. Held jointly with 11th International Conference on Embedded Systems - Hyderabad (2012.01.7-2012.01.11)] 2012 25th International Conference on VLSI Design - Embedded Tutorial ET3: Packaging Trends, Die Package Co-Design Flow and Challenges

Kothamasu, S.

作者Kothamasu, S.
文件大小141.58KB
发表时间2012
DOI10.1109/vlsid.2012.40
页码35-35

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