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Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED Modules

Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED Modules

Juntunen, Eveliina; Sitomaniemi, Aila; Tapaninen, Olli; Persons, Ryan; Challingsworth, Mark; Heikkinen, Veli
  • 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
  • 作者Juntunen, Eveliina; Sitomaniemi, Aila; Tapaninen, Olli; Persons, Ryan; Challingsworth, Mark; Heikkinen, Veli
  • 卷第2卷
  • 期第12期
  • 印刷ISSN2156-3950
  • 电子ISSN2156-3985
  • 文件大小1038.88KB
  • 发表时间2012-12
  • DOI10.1109/tcpmt.2012.2206390
  • 页码1957-1964
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