[IEEE 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Cascais, Portugal (2012.04.16-2012.04.18)] 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Thermosonic flip-chip assembly on flex substrates

• 作者Dou, Guangbin; Holmes, Andrew S.
• 文件大小1051.85KB
• 发表时间2012
• DOI10.1109/esime.2012.6191785