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[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Effects of stacking sequence of electrodeposited Sn and Bi layers on reflowed Sn-Bi solder alloys

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Effects of stacking sequence of electrodeposited Sn and Bi layers on reflowed Sn-Bi solder alloys

Seen Fang Lee, ; Yingxin Goh, ; Haseeb, A.S.M.A.
  • 作者Seen Fang Lee, ; Yingxin Goh, ; Haseeb, A.S.M.A.
  • 文件大小1125.11KB
  • 发表时间2012
  • DOI10.1109/iemt.2012.6521792
  • 页码1-6
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