发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Modeling for critical design and performance of wafer level chip scale package

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Modeling for critical design and performance of wafer level chip scale package

Liu, Yong; Qian, Qiuxiao; Ring, Matt; Kim, Jihwan; Kinzer, Dan

作者Liu, Yong; Qian, Qiuxiao; Ring, Matt; Kim, Jihwan; Kinzer, Dan
文件大小2307.96KB
发表时间2012
DOI10.1109/ectc.2012.6248985
页码1174-1182

← 返回【学霸图书馆】主页