[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Memory-efficient logic layer communication platform for 3D-stacked memory-on-processor architectures
Daneshtalab, Masoud; Ebrahimi, Masoumeh; Liljeberg, Pasi; Plosila, Juha; Tenhunen, Hannu
- 作者Daneshtalab, Masoud; Ebrahimi, Masoumeh; Liljeberg, Pasi; Plosila, Juha; Tenhunen, Hannu
- 文件大小290.77KB
- 发表时间2012
- DOI10.1109/3DIC.2012.6263024
- 页码1-8