Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating
- 期刊名称MATERIALS TRANSACTIONS
- 作者Fujiwara, Shinichi; Dauskardt, Reinhold H.
- 卷第53卷
- 期第12期
- 印刷ISSN1345-9678
- 电子ISSN1347-5320
- 文件大小3436.23KB
- 发表时间2012
- DOI10.2320/matertrans.mb201203
- 页码2091-2096
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