Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiP

• 作者Jiajie Tang; Xiaoyun Ding; Fei Geng; Xiaowei Sun; Le Luo
• 卷第18卷
• 期第1期
• 印刷ISSN0946-7076
• 电子ISSN1432-1858
• 文件大小838.89KB
• 发表时间2012-01
• DOI10.1007/s00542-011-1370-3
• 页码119-126