Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test
- 作者Yanhong Tian; Wei Liu; Rong An; Wei Zhang; Lina Niu; Chunqing Wang
- 卷第23卷
- 期第1期
- 印刷ISSN0957-4522
- 电子ISSN1573-482X
- 文件大小3061.64KB
- 发表时间2012-01
- DOI10.1007/s10854-011-0538-z
- 页码136-147