Embedded packaging and assembly; Reliability and supply chain implications
- 期刊名称Microelectronics Reliability
- 作者Bauer, Charles E.; Neuhaus, Herbert J.
- 卷第53卷
- 印刷ISSN0026-2714
- 文件大小1173.97KB
- 发表时间2013-9
- DOI10.1016/j.microrel.2013.07.106
- 页码1179-1182
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