Modelling methodology for thermal analysis of hot solder dip process
Stoyanov, Stoyan; Bailey, Chris; Alam, M.O.; Yin, Chunyan; Best, Chris; Tollafield, Peter; Crawford, Rob; Parker, Mike; Scott, Jim
- 期刊名称Microelectronics Reliability
- 作者Stoyanov, Stoyan; Bailey, Chris; Alam, M.O.; Yin, Chunyan; Best, Chris; Tollafield, Peter; Crawford, Rob; Parker, Mike; Scott, Jim
- 卷第53卷
- 期第8期
- 印刷ISSN0026-2714
- 文件大小7023.04KB
- 发表时间2013-8
- DOI10.1016/j.microrel.2013.02.018
- 页码1055-1067