Trends in automotive power semiconductor packaging
- 期刊名称Microelectronics Reliability
- 作者Dietrich, Peter
- 卷第53卷
- 印刷ISSN0026-2714
- 文件大小2126.72KB
- 发表时间2013-9
- DOI10.1016/j.microrel.2013.07.088
- 页码1681-1686
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