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Experimental study and modeling of the effect of mixed size abrasive grits on surface topology and removal rate in wafer lapping

Experimental study and modeling of the effect of mixed size abrasive grits on surface topology and removal rate in wafer lapping

Zhu, Xiaohai; Chung, Chunhui; Korach, Chad S.; Kao, Imin
  • 期刊名称Wear
  • 作者Zhu, Xiaohai; Chung, Chunhui; Korach, Chad S.; Kao, Imin
  • 卷第305卷
  • 印刷ISSN0043-1648
  • 文件大小6865.61KB
  • 发表时间2013-07
  • DOI10.1016/j.wear.2013.05.007
  • 页码14-22
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