Book review: Design and modeling for 3D ICs and interposers
- 期刊名称IEEE Electromagnetic Compatibility Magazine
- 作者Orlandi, Antonio; Swaminathan, Madhavan; Han, Ki Jin
- 卷第2卷
- 期第4期
- 印刷ISSN2162-2264
- 电子ISSN2162-2272
- 文件大小2866.66KB
- 发表时间2013
- DOI10.1109/MEMC.2013.6714696
- 页码48-49
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