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[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Logi-thermal simulation using high-resolution temperature dependent delay models

[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Logi-thermal simulation using high-resolution temperature dependent delay models

Timar, Andras; Rencz, Marta

作者Timar, Andras; Rencz, Marta
文件大小538.84KB
发表时间2013
DOI10.1109/therminic.2013.6675214
页码376-380

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