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[IEEE 2013 International Semiconductor Conference Dresden - Grenoble (ISCDG) - Dresden, Germany (2013.09.26-2013.09.27)] 2013 International Semiconductor Conference Dresden - Grenoble (ISCDG) - Model of mutual coupling between two bonding wires on glass substrate

[IEEE 2013 International Semiconductor Conference Dresden - Grenoble (ISCDG) - Dresden, Germany (2013.09.26-2013.09.27)] 2013 International Semiconductor Conference Dresden - Grenoble (ISCDG) - Model of mutual coupling between two bonding wires on glass substrate

Dinh, Thanh Vinh; Pasquet, Daniel; Descamps, Philippe; Lesenechal, Dominique; Pagazani, Julien; Lissorgues, Gaelle; Nicole, Pierre
  • 作者Dinh, Thanh Vinh; Pasquet, Daniel; Descamps, Philippe; Lesenechal, Dominique; Pagazani, Julien; Lissorgues, Gaelle; Nicole, Pierre
  • 文件大小1935.64KB
  • 发表时间2013
  • DOI10.1109/iscdg.2013.6656302
  • 页码1-4
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