[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Mean-time-to-crack model of microbump interconnect in FCGBA package under thermal cyclic test
Chen, Chien-Chang; Wu, Wei-Chen; Chin, Ching-Yu; Chen, Hung-Ming; Lin, Vito; Chen, Eason
- 作者Chen, Chien-Chang; Wu, Wei-Chen; Chin, Ching-Yu; Chen, Hung-Ming; Lin, Vito; Chen, Eason
- 文件大小887.66KB
- 发表时间2013
- DOI10.1109/therminic.2013.6675215
- 页码104-109