On Effective Through-Silicon Via Repair for 3-D-Stacked ICs

• 期刊名称IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
• 作者Jiang, Li; Xu, Qiang; Eklow, Bill
• 卷第32卷
• 期第4期
• 印刷ISSN0278-0070
• 电子ISSN1937-4151
• 文件大小9906.81KB
• 发表时间2013-04
• DOI10.1109/tcad.2012.2228742
• 页码559-571