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Design and Modeling for 3D ICs and Interposers || Power Distribution, Return Path Discontinuities and Thermal Management

Design and Modeling for 3D ICs and Interposers || Power Distribution, Return Path Discontinuities and Thermal Management

Swaminathan, Madhavan; Han, Ki Jin

作者Swaminathan, Madhavan; Han, Ki Jin
文件大小4389.66KB
发表时间2013
DOI10.1142/9789814508605_0005
页码245-294

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