Solidification and reliability of lead‐free solder interconnection
- 期刊名称Soldering & Surface Mount Technology
- 作者Yu, Hao; Shangguan, Dongkai
- 卷第25卷
- 期第1期
- 印刷ISSN0954-0911
- 文件大小439.04KB
- 发表时间2013-02
- DOI10.1108/09540911311294632
- 页码31-38
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