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[ACM Press the 17th International Software Product Line Conference - Tokyo, Japan (2013.08.26-2013.08.30)] Proceedings of the 17th International Software Product Line Conference on - SPLC '13 - Product line engineering for globalization

[ACM Press the 17th International Software Product Line Conference - Tokyo, Japan (2013.08.26-2013.08.30)] Proceedings of the 17th International Software Product Line Conference on - SPLC '13 - Product line engineering for globalization

Schmid, Klaus; Lee, Seiyoung

作者Schmid, Klaus; Lee, Seiyoung
文件大小670.65KB
发表时间2013
DOI10.1145/2491627.2493902

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