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System Level Methodology for Interconnect Aware and Temperature Constrained Power Management of 3-D MP-SOCs

System Level Methodology for Interconnect Aware and Temperature Constrained Power Management of 3-D MP-SOCs

Kumar, Sumeet S.; Aggarwal, Arnica; Jagtap, Radhika Sanjeev; Zjajo, Amir; van Leuken, Rene
  • 期刊名称IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • 作者Kumar, Sumeet S.; Aggarwal, Arnica; Jagtap, Radhika Sanjeev; Zjajo, Amir; van Leuken, Rene
  • 卷第22卷
  • 期第7期
  • 印刷ISSN1063-8210
  • 电子ISSN1557-9999
  • 文件大小3503.64KB
  • 发表时间2014-7
  • DOI10.1109/TVLSI.2013.2273003
  • 页码1606-1619
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