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Microstructure evolution, hardening and thermal behavior of commercially pure copper subjected to torsion deformation

Microstructure evolution, hardening and thermal behavior of commercially pure copper subjected to torsion deformation

Wang, Chengpeng; Li, Fuguo; Li, Jinghui; Dong, Junzhe; Xue, Fengmei

期刊名称Materials Science and Engineering: A
作者Wang, Chengpeng; Li, Fuguo; Li, Jinghui; Dong, Junzhe; Xue, Fengmei
卷第598卷
印刷ISSN0921-5093
文件大小4375.93KB
发表时间2014-03
DOI10.1016/j.msea.2013.12.079
页码7-14

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