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Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads

Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads

Tian, Yanhong; Zhang, Rui; Hang, Chunjin; Niu, Lina; Wang, Chunqing

期刊名称Materials Characterization
作者Tian, Yanhong; Zhang, Rui; Hang, Chunjin; Niu, Lina; Wang, Chunqing
卷第88卷
印刷ISSN1044-5803
文件大小4393.00KB
发表时间2014-02
DOI10.1016/j.matchar.2013.12.006
页码58-68

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