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Diffusion Bonding of Microduplex Stainless Steel and Ti Alloy with and without Interlayer: Interface Microstructure and Strength Properties

Diffusion Bonding of Microduplex Stainless Steel and Ti Alloy with and without Interlayer: Interface Microstructure and Strength Properties

Kundu, S.; Sam, S.; Mishra, B.; Chatterjee, S.

期刊名称Metallurgical and Materials Transactions A
作者Kundu, S.; Sam, S.; Mishra, B.; Chatterjee, S.
卷第45卷
期第1期
印刷ISSN1073-5623
电子ISSN1543-1940
文件大小1602.01KB
发表时间2014-01
DOI10.1007/s11661-013-1977-3
页码371-383

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