Improved Thermal Performance of SOI Using a Compound Buried Layer

Baine, Paul; Montgomery, John H.; Armstrong, B. Mervyn; Gamble, Harold S.; Harrington, Sarah J.; Nigrin, Sydney; Wilson, Robin; Oo, Kean B.; Armstrong, Alastair G.; Suder, Suli

期刊名称IEEE Transactions on Electron Devices
作者Baine, Paul; Montgomery, John H.; Armstrong, B. Mervyn; Gamble, Harold S.; Harrington, Sarah J.; Nigrin, Sydney; Wilson, Robin; Oo, Kean B.; Armstrong, Alastair G.; Suder, Suli
卷第61卷
期第6期
印刷ISSN0018-9383
电子ISSN1557-9646
文件大小1532.25KB
发表时间2014-6
DOI10.1109/TED.2014.2318832
页码1999-2006

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Improved Thermal Performance of SOI Using a Compound Buried Layer