![Reliability aspects of copper metallization and interconnect technology for power devices]()
Reliability aspects of copper metallization and interconnect technology for power devicesHille, Frank; Roth, Roman; Schäffer, Carsten; Schulze, Holger; Heuck, Nicolas; Bolowski, Daniel; Guth, Karsten; Ciliox, Alexander; Rott, Karina; Umbach, Frank; Kerber, Martin · Microelectronics Reliability · 2016