Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Nimura, Masatsugu; Mizuno, Jun; Shoji, Shuichi; Sakuma, Katsuyuki; Ogino, Hiroshi; Enomoto, Tomoyuki; Shigetou, Akitsu
- 卷第4卷
- 期第5期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小3702.72KB
- 发表时间2014-5
- DOI10.1109/TCPMT.2014.2311094
- 页码762-768
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