Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs

• 期刊名称IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
• 作者Wang, Ran; Chakrabarty, Krishnendu; Eklow, Bill
• 卷第33卷
• 期第9期
• 印刷ISSN0278-0070
• 电子ISSN1937-4151
• 文件大小3380.22KB
• 发表时间2014-9
• DOI10.1109/tcad.2014.2331336
• 页码1410-1423