[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Rapid formation of Cu-Sn intermetallic compounds by strong electric current
Liu, Baolei; Tian, Yanhong; Wang, Shang; Zhang, Rui; Zhao, Xin; Dong, Chenglong; Wang, Chunqing
- 作者Liu, Baolei; Tian, Yanhong; Wang, Shang; Zhang, Rui; Zhao, Xin; Dong, Chenglong; Wang, Chunqing
- 文件大小2141.20KB
- 发表时间2014
- DOI10.1109/icept.2014.6922702
- 页码489-492