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[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal Modeling Improvements using substrate ECAD integration

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal Modeling Improvements using substrate ECAD integration

Jha, Vibhash; Hauck, Torsten

作者Jha, Vibhash; Hauck, Torsten
文件大小634.23KB
发表时间2014
DOI10.1109/itherm.2014.6892391
页码1007-1010

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