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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Study on the board-level drop test of the stacked memory device by FEA

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Study on the board-level drop test of the stacked memory device by FEA

Pang, Junwen; Wang, Jun; Zhao, Liyou

作者Pang, Junwen; Wang, Jun; Zhao, Liyou
文件大小514.27KB
发表时间2014
DOI10.1109/icept.2014.6922753
页码724-727

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