Evaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing
Ash, William M.; Meredith, William F.; Banks, Charles A.; Neskovski, Nikola Nick; Wolff, Brian; Monroe, Kathleen; Casasnovas, Anthony
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Ash, William M.; Meredith, William F.; Banks, Charles A.; Neskovski, Nikola Nick; Wolff, Brian; Monroe, Kathleen; Casasnovas, Anthony
- 卷第4卷
- 期第12期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小5272.46KB
- 发表时间2014-12
- DOI10.1109/tcpmt.2014.2358574
- 页码1989-1998