![[IEEE 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Diego, CA, USA (2016.10.23-2016.10.26)] 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) - Toward predictive modeling of full-size packages with layered-medium integral-equation methods]()
[IEEE 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Diego, CA, USA (2016.10.23-2016.10.26)] 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) - Toward predictive modeling of full-size packages with layered-medium integral-equation methodsLiu, C.; Menshov, A.; Subramanian, V.; Aygun, K.; Braunisch, H.; Okhmatovski, V. I.; Yilmaz, A. E. · 2016