A process analysis for microchannel deformation and bonding strength by in-mold bonding of microfluidic chips
- 期刊名称Journal of Polymer Engineering
- 作者Chu, Chunpeng; Jiang, Bingyan; Zhu, Laiyu; Jiang, Fengze
- 印刷ISSN0334-6447
- 电子ISSN2191-0340
- 文件大小4093.33KB
- 发表时间2014-01-12
- DOI10.1515/polyeng-2013-0092