[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Study of gold wire bonding on 0.1 μm soft gold film substrate
- 作者Zhang, Ruonan; Guo, Rui; Li, Ming; Qian, Kaiyou; Chiu, Hope
- 文件大小1310.56KB
- 发表时间2014
- DOI10.1109/ICEPT.2014.6922635
- 页码196-199
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Practical Performance of MANETs Under Limited Buffer and Packet LifetimeFang, Yujian; Zhou, Yuezhi; Jiang, Xiaohong; Zhang, Yaoxue · IEEE Systems Journal · 2015
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