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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - A novel method to fabricate AlN-Al<inf>2</inf>O<inf>3</inf> multiphase ceramic layer on WCu alloy

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - A novel method to fabricate AlN-Al2O3 multiphase ceramic layer on WCu alloy

Zhu, Jiandong; An, Rong; Wang, Chunqing; Tian, Yanhong; Wen, Guangwu

作者Zhu, Jiandong; An, Rong; Wang, Chunqing; Tian, Yanhong; Wen, Guangwu
文件大小3132.74KB
发表时间2014
DOI10.1109/ICEPT.2014.6922626
页码155-158

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