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[IEEE 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Cannes, France (2014.4.1-2014.4.4)] 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Creep in MEMS

[IEEE 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Cannes, France (2014.4.1-2014.4.4)] 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Creep in MEMS

Soma, A.; De Pasquale, G.; Saleem, M. M.

作者Soma, A.; De Pasquale, G.; Saleem, M. M.
文件大小756.78KB
发表时间2014
DOI10.1109/dtip.2014.7056680
页码1-4

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