Control Technique of Solidus Temperature on Gold Base Solder for SiC Devices with High Temperature Operation
TAKAHASHI, Hiroki; TAKAHASHI, Hiroki; MURAKAMI, Yoshinori; MURAKAMI, Yoshinori; ANZAI, Takeshi; ANZAI, Takeshi; KATO, Fumiki; KATO, Fumiki; WATANABE, Kinuyo; SATO, Shinji; SATO, Shinji; TANISAWA, Hidekazu; TANISAWA, Hidekazu; HIYAMA, Kohei; HIYAMA, Kohei; SATO, Hiroshi; SATO, Hiroshi
- 期刊名称Journal of Smart Processing
- 作者TAKAHASHI, Hiroki; TAKAHASHI, Hiroki; MURAKAMI, Yoshinori; MURAKAMI, Yoshinori; ANZAI, Takeshi; ANZAI, Takeshi; KATO, Fumiki; KATO, Fumiki; WATANABE, Kinuyo; SATO, Shinji; SATO, Shinji; TANISAWA, Hidekazu; TANISAWA, Hidekazu; HIYAMA, Kohei; HIYAMA, Kohei; SATO, Hiroshi; SATO, Hiroshi
- 卷第3卷
- 期第4期
- 印刷ISSN2186-702X
- 电子ISSN2187-1337
- 文件大小1431.66KB
- 发表时间2014
- DOI10.7791/jspmee.3.205
- 页码205-211