Evolution of Microstructure Across Eutectic Sn-Bi Solder Joints Under Simultaneous Thermal Cycling and Current Stressing
- 期刊名称Journal of Electronic Materials
- 作者Zuo, Yong; Ma, Limin; Liu, Sihan; Shu, Yutian; Guo, Fu
- 卷第44卷
- 期第1期
- 印刷ISSN0361-5235
- 电子ISSN1543-186X
- 文件大小930.44KB
- 发表时间2015-1
- DOI10.1007/s11664-013-2972-6
- 页码597-603
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