Agglomeration and diffusion in Cu thin films under supercritical CO
2
annealing
Nakamura, Yoshiki; Watanabe, Mitsuhiro; Kondoh, Eiichi
- 期刊名称Japanese Journal of Applied Physics
- 作者Nakamura, Yoshiki; Watanabe, Mitsuhiro; Kondoh, Eiichi
- 卷第54卷
- 印刷ISSN0021-4922
- 电子ISSN1347-4065
- 文件大小1058.86KB
- 发表时间2015-05-01
- DOI10.7567/jjap.54.05ea03