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A study on separating of a silicon wafer with moving laser beam by using thermal stress cleaving technique

A study on separating of a silicon wafer with moving laser beam by using thermal stress cleaving technique

Saman, Alias Mohd; Furumoto, Tatsuaki; Ueda, Takashi; Hosokawa, Akira

期刊名称Journal of Materials Processing Technology
作者Saman, Alias Mohd; Furumoto, Tatsuaki; Ueda, Takashi; Hosokawa, Akira
卷第223卷
印刷ISSN0924-0136
文件大小3443.48KB
发表时间2015-09
DOI10.1016/j.jmatprotec.2015.04.001
页码252-261

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