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Intrinsic stress analysis of tungsten-lined open TSVs

Filipovic, Lado; Singulani, Anderson Pires; Roger, Frederic; Carniello, Sara; Selberherr, Siegfried

期刊名称Microelectronics Reliability
作者Filipovic, Lado; Singulani, Anderson Pires; Roger, Frederic; Carniello, Sara; Selberherr, Siegfried
印刷ISSN0026-2714
文件大小1239.87KB
发表时间2015-6
DOI10.1016/j.microrel.2015.06.014