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The atomic behavior during heating in the amorphous diffusion nanolayer between Cu and solder

The atomic behavior during heating in the amorphous diffusion nanolayer between Cu and solder

Pan, Chien-Cheng; Lin, Yu-Wei; Lin, Chien-I; Mittal, Jagjiwan; Lin, Kwang-Lung

期刊名称Journal of Non-Crystalline Solids
作者Pan, Chien-Cheng; Lin, Yu-Wei; Lin, Chien-I; Mittal, Jagjiwan; Lin, Kwang-Lung
卷第430卷
印刷ISSN0022-3093
文件大小2308.26KB
发表时间2015-12
DOI10.1016/j.jnoncrysol.2015.09.022
页码38-42

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