Multiscale Transient Thermal Analysis of Microelectronics
- 期刊名称Journal of Electronic Packaging
- 作者Barabadi, Banafsheh; Kumar, Satish; Sukharev, Valeriy; Joshi, Yogendra K.
- 卷第137卷
- 期第3期
- 印刷ISSN1043-7398
- 文件大小1638.34KB
- 发表时间2015-09-01
- DOI10.1115/1.4029835
Development of Microtubular SOFCsSuzuki, Toshio; Funahashi, Yoshihiro; Yamaguchi, Toshiaki; Fujishiro, Yoshinobu; Awano, Masanobu · Journal of Fuel Cell Science and Technology · 2008
Bipolar Plates for PEMFCsSequeira, C. A. C.; Amaral, L. · Journal of Fuel Cell Science and Technology · 2014
EditorialSammes, Nigel M. · Journal of Fuel Cell Science and Technology · 2004
Hydrogen Fuel: Opportunities and BarriersKumar, Prashant; Britter, Rex; Gupta, Nitesh · Journal of Fuel Cell Science and Technology · 2009
Fuel Cells and CogenerationParise, J. A. R.; Vargas, J. V. C.; Marques, R. Pitanga · Journal of Fuel Cell Science and Technology · 2008
Designing Microfuel Cells for Portable ElectronicsFlipsen, Bas · Journal of Fuel Cell Science and Technology · 2010
DOE FE Distributed Generation ProgramWilliams, Mark C.; Utz, Bruce R.; Moore, Kevin M. · Journal of Fuel Cell Science and Technology · 2004
Entropy Based Design of Fuel CellsNaterer, G. F.; Tokarz, C. D. · Journal of Fuel Cell Science and Technology · 2006