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[IEEE 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Paris, France (2015.9.30-2015.10.2)] 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Electro-thermo-mechanical modelling and analysis of the press pack diode in power electronics

[IEEE 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Paris, France (2015.9.30-2015.10.2)] 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Electro-thermo-mechanical modelling and analysis of the press pack diode in power electronics

Rajaguru, P.; Lu, H.; Bailey, C.; Ortiz-Gonzalez, J.; Alatise, O.
  • 作者Rajaguru, P.; Lu, H.; Bailey, C.; Ortiz-Gonzalez, J.; Alatise, O.
  • 文件大小843.07KB
  • 发表时间2015
  • DOI10.1109/therminic.2015.7389607
  • 页码1-6
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