[IEEE 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) - Brasov, Romania (2015.10.22-2015.10.25)] 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) - A research of the characteristics of materials used in the construction of EDLCs
- 作者Negroiu, R.; Badalan, N.; Vasile, Al.; Marghescu, C.
- 文件大小717.52KB
- 发表时间2015
- DOI10.1109/siitme.2015.7342302
- 页码95-98