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4.2: Study of ACF Bonding Technology in Flexible Display Module Packages

Lai, Yen-Huei; Wang, Wan-Tsang; Tu, Chia-Hsun; Hwu, Keh-Long; Lu, Hsueh-Hsing; Chang, Lee-Hsun; Lin, Yu-Hsin

期刊名称SID Symposium Digest of Technical Papers
作者Lai, Yen-Huei; Wang, Wan-Tsang; Tu, Chia-Hsun; Hwu, Keh-Long; Lu, Hsueh-Hsing; Chang, Lee-Hsun; Lin, Yu-Hsin
卷第46卷
期第1期
印刷ISSN0097-966X
文件大小1069.14KB
发表时间2015-06
DOI10.1002/sdtp.10170
页码12-15